Serving Eastern Massachusetts
Course Description
| Course Name: | Challenges and Fundamentals of MEMS Packaging |
| Time & Date: | Mondays, 6:30 – 9 PM, April 5, 12, 19, 26, May 3 |
| Location: | Holiday Inn Select Hotel, 15 Middlesex Canal Park Rd., Woburn, MA |
| Speaker: | Andrew Oliver, Aglittron |
Overview
This course provides an overview of packaging for both Microelectronics and Microsystems (MEMS, sensors, optoelectronics, etc). Packaging is less glamorous and less studied than device physics, device fabrication, circuit design, and many of the other areas in Microelectronics and Micro. However, it tends to dominate the cost, size, and performance of devices. This course will discuss the basics of packaging. At the end of the course, students should have a good understanding of the fundamentals of packaging, packaging processes, and how to design devices so that they can be packaged. Because of the diverse student body, topics of interest to students including biomedical packaging, VLSI packaging, and RF packaging will be covered in the last lecture. Following the 5 lecture sessions, a tour will be given of a local packaging assembly operation.
Outline
Session 1.
Introduction and electrical aspects of packaging Session
Session 2.
Mechanical and thermal aspects of packaging, package types, dicing, die attach Session
Session 3.
Wirebonding, flip chip, multichip modules, packaging reliability and failure mechanisms
Session 4.
Hermetic and non hermetic sealing, wafer bonding, assembly and alignment of Microsystems
Session 5.
Applications of interest to students. Potential topics include MEMS packaging, RF packaging, medical device packaging, automotive packaging, lead free packaging.
Session 6
(tentative) Tour of a packaging operation
Target Audience
Engineers and students who work in the area of electronics, microelectronics, or microsystems.
Benefits of attending
Students will learn how the microelectronics and microsystems are packaged. This includes the operations involved in packaging and how the package influences the electrical, thermal, and mechanical performance of a device. The tradeoffs in packaging will be discussed and the student will learn how to design a device so that it can be packaged economically and with a high degree of reliability. The different aspects of packaging that are important for MEMS and microsystems will also be discussed.
Speaker’s Bio
Andrew “Andy” Oliver has worked in all areas of MEMS design, fabrication and packaging for 18 years including Ion Optics/ICx Photonics in Billerica and Triton Systems in Chelmsford. Prior to this, he was a principal member of the technical staff in the packaging group at Sandia National Laboratories. This course is based on a three credit course on packaging that he developed and taught at the University of New Mexico.
Decision (Run/Cancel) Date for this Courses is Friday, March 26, 2010
FEES
Payment received by March 23: IEEE Members $280
Payment received by March 23: Non-members $305
Payment received after March 23: IEEE Members $305
Payment received after March 23: Non-members $335